Rigid-flex PCB
Connect rigid component areas with integrated flexible circuits. Compare construction choices before committing your design to fabrication.
Explore construction →RIGID FLEX PCB / DESIGN TO FABRICATIONRigid Flex PCB.
Rigid Flex PCB.
Connect your design.
Explore rigid-flex PCB construction, solve packaging challenges and prepare a better manufacturing brief.
Design with contextElectrical + mechanical requirementsSpecify with clarityStackup, materials and surface finishReview with confidenceProject data before production
01 / THE RIGHT CONSTRUCTIONOne project.
One project.
The right circuit architecture.
Start with how your product fits, moves and connects. Compare the options before fixing the construction.
Flexible PCB
Plan a flexible circuit around its electrical path, mechanical support and intended motion.
Explore construction →Rigid PCB
Build a clear fabrication specification for rigid circuit boards and compare connector-based architectures with rigid-flex.
Explore construction →Metal core PCB
Understand the thermal stack before specifying a metal-backed circuit board.
Explore construction →02 / UNDERSTAND THE STACKMore than a board.
More than a board.
An integrated connection.
A rigid-flex PCB combines rigid component-support areas with flexible interconnecting regions. Its value comes from the complete assembly: packaging, interconnect count, installation and serviceability.
Begin with a region-specific stackup. Then align the electrical design with the bend envelope and manufacturing requirements.
Understand stackups and materials →ILLUSTRATIVE LAYER RELATIONSHIPS · NOT A FABRICATION STACKUP
Rigid region / component support
Copper routing / electrical connection
Dielectric and bonding / separation
Flexible core / interconnecting span
Coverlay / flexible-region protection
Actual layer counts and thicknesses are project-specific.03 / ENGINEERING WORKBENCH
Turn questions into useful inputs.
Explore finish units, cost factors and design readiness before requesting a review.
Gold thickness converter
Convert specification units. This tool does not recommend a plating thickness.
1 µin = 0.0254 µm.
Cost drivers explorer
See which design decisions need review. This is not a price estimate.
Design readiness checklist
Prepare the information needed for a review. Your selections stay in this page.
04 / APPLICATION CONTEXT
Designed around the real world.
Different environments need different evidence. Explore the requirements that shape each application.
Medical Devices
Plan compact electronics around traceability, cleanability and the intended use environment.
Explore design priorities →Aerospace
Evaluate weight, packaging and interconnect reliability against a documented mission profile.
Explore design priorities →Automotive
Review a circuit against its mounting location, environment and production lifecycle.
Explore design priorities →Industrial Systems
Design interconnects for the actual duty cycle, service environment and maintenance strategy.
Explore design priorities →Telecom & Networking
Coordinate high-speed signal paths, grounding and thermal packaging across multiple board regions.
Explore design priorities →Consumer Electronics
Balance compact packaging with assembly yield, durability and product serviceability.
Explore design priorities →05 / A CLEARER HANDOFF
From your idea to a reviewable brief.
01
Define the requirements
Share electrical targets, mechanical constraints, quantity and timing.
02
Review the construction
Resolve stackup, materials, bend regions and manufacturing questions.
03
Confirm the release
Agree the revision, acceptance criteria and commercial scope before fabrication.
06 / COMMON QUESTIONS
A better starting point.
What is a rigid-flex PCB?
It is an integrated board construction with rigid component-support areas and flexible interconnecting regions. The flex layers and rigid layers are defined by a region-specific stackup.
Is rigid-flex always cheaper?
No. Compare the full assembly, including connectors, cables, assembly labor, testing, expected yield and repair strategy. Bare-board price is only one part of the decision.
What determines a safe bend radius?
The flexible-region construction, copper and dielectric thickness, bend direction, motion and environment all matter. Confirm the radius against the proposed stackup and validate the actual use condition.
Can a gold thickness converter select my finish?
No. It converts units only. Pad function, soldering or mating requirements, process and acceptance criteria determine the appropriate finish.
What files are needed for a quote?
Provide fabrication data, drill files, stackup, outline, bend diagram, quantity and requested timing. Include impedance, finish and acceptance requirements, and identify the revision.
Further technical reading
Compare this approach with a rigid-flex construction overview and additional design and fabrication considerations when preparing your project brief.
FROM DRAWING TO DISCUSSION
Start your project ↗Bring your next connection into focus.
Share the stackup, bend requirements and quantity. Start with the details that make an engineering review useful.