Antenna clearance in folded electronic assemblies
October 29, 2026
Antenna clearance in a folded assembly must be reviewed in three dimensions.
PCB Engineering Knowledge Center
Design, manufacturing and application guides.
Vibration constraints in an industrial controller
October 28, 2026
Vibration review for an industrial controller should include the enclosure, mounting features, rigid islands, and flexible connections as one mechanical…
Mechanical constraints in a compact patient monitor
October 27, 2026
A compact patient-monitor concept needs a mechanical interface map before its rigid-flex outline is fixed.
Comparing bare-board and assembled-system cost
October 26, 2026
Compare a rigid-flex architecture at the level of the deliverable you need.
AOI: defect coverage and limitations
October 25, 2026
Automated optical inspection, or AOI, provides evidence about features observable by the configured optical inspection process.
Microinches to micrometres: gold thickness conversion
October 24, 2026
To convert a gold thickness from microinches to micrometres, multiply by 0.0254.
Drill data review for plated and non-plated features
October 23, 2026
Drill data should identify the geometry of each hole and the manufacturing meaning of the feature.
What an impedance coupon can and cannot establish
October 22, 2026
An impedance coupon is a defined test structure used to obtain evidence about a manufactured transmission-line construction.
Total layers versus flex layers: why both matter
October 21, 2026
Specify both the total copper-layer construction and the copper layers present in each flexible region when describing a rigid-flex PCB.
Static bending versus dynamic flexing: writing the requirement
October 20, 2026
A useful flex requirement describes the motion the circuit will experience.