Application context
Rigid-flex can be considered where packaging volume and interconnect mass are important. Electrical, mechanical and serviceability requirements must be assessed together before selecting the architecture.
Requirements to define
Supply the vibration environment, thermal profile, mechanical constraints, life expectations and applicable program requirements. A static fold during assembly and an interconnect exposed to continuous motion require different validation.
Evidence to request
Confirm the exact supplier qualification, certification scope and traceability requirements with current supporting documents. This application guide does not claim an aerospace approval or manufacturing certification.
Prepare your project review
Submit the board outline, region-specific stackup, bend diagram, fabrication data, quantity and required timing. Identify the part revision and mark preliminary information. Include the application-specific acceptance requirements so engineering and purchasing evaluate the same scope.